flipped chip meaning in Chinese
倒装芯片
Examples
- The reworkable underfills technology for flip chip
倒装芯片的可修复底部填充技术 - Research on the thermode bonding procee for flip chip
倒装芯片热电极键合工艺研究 - Implementation of flip chip and chip scale technology
叩焊晶片和晶片标度技术的执行 - Flip chip will be a new method of packaging technology
倒装芯片将成为封装技术的最新手段 - Bump fabrication methods for flip chip
倒装芯片凸点制作方法